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COMPANY PROFILE

Shenzhen Weijin Technology Co., Ltd. was established in 2012. It is a one-stop intelligent manufacturing digital factory focusing on PCBA design and development, PCBA OEM, SMT patch processing, DIP plug-in, post-welding, testing, product spray_x0002_ing, and finished product assembly.

Weijin currently has internationally leading multi-functional high-speed placement machines, 5 SMT production lines, 2 DIP plug-in production lines, 2 assembly lines, and a series of high-precision testing equipment and reliability testing equipment more than 20 sets, with a daily output of up to 10 million points. (The SMT process capabili_x0002_ty can mount the smallest component 01005, the minimum mounting accuracy can reach +/-0.03mm, and the minimum pin spacing can be mounted 0.25mm chip.)

Our company has passed the ISO9001:2015 quality management system certification. Since its establishment, the company has been serving customers in multiple countries and regions for a long time. Our business covers automotive electronics, new energy, industrial control electronics, pet electronics, communication electronics, security electronics, consumer electronics, commercial displays, smart homes, and more.

14+
Industry experience
80 +
Number of employees
2000
Factory area
1000 +
With a daily output of up
Corporate Culture
  • Our Mission

    The company strives for the material and spiritual well-being of all employees, and aims to contribute to making China's electronics industry the best in the world by providing products and services that exceed customer expectations.

  • Our Corporate Vision

    To become a PCBA manufacturing service provider that employees are proud of, customers can rely on, and is recognized as the best in the industry.

  • Our core values

    Gratitude, altruism, integrity, pragmatism, efficiency, innovation.

Organizational structure

Weijin Technology Nine Quality Assurance

Choosing Weijin Technology = choosing a professional PCBA processing factory

Prenatal ReviewThe Engineering Department organizes the production department, purchasing department, and quality department personnel to introduce new products, and holds new product introduction meetings to ensure that the project is delivered with quality and quantity guaranteed.

01

BOM ReviewCheck the PGB documents and drawing coordinates of the container, proofread the BON order, optimize the material description, check the type guide, package, and quantity number, and improve the brand specifications and material number information.

02

Process ReviewFormulate new material/new process/new design operation requirements, review and confirm data files, whether material and PCB specifications meet machine requirements, and material baking conditions.

03

Material InspectionImplement new material sample management to ensure that the quality of material samples can meet product requirements and serve as the basis for purchase orders and incoming material inspection.

04

Incoming material inspectionInspect raw materials to ensure product quality. Measure resistance and capacitance values, screen printing of Class A materials, check the matching degree between components and PADs, check whether the leads are deformed and oxidized, and the appearanceof PCB according to the BON list.

05

Tooling VerificationThe engineering department shall provide drawings and specifications for new steel meshes, test fixtures, wave soldering fixtures, and panel separation fixtures, and indicate the process material requirements.

06

Furnace temperature monitoringThe 9-channel furnace temperature tester combines the PCBA physical board to test the actual soldering temperature, 260℃<10S, 235℃60-90S.

07

First Article Inspection By integrating the BOM table, coordinates and high-definition scanned first-article images to automatically generate inspection programs, components can be inspected quickly and accurately, and the results can be automatically determined and first-article reports can be generated to enhance quality control.

08

Process detection Fully automated process inspection, first piece inspection instrument, SPI solder paste inspection instrument, 100% AOI inspection, BGA device X-Ray inspection.

09