Shenzhen Weijin Technology Co., Ltd. (referred to as Weijin Technology) was established in 2012, located in Fuyong, Bao'an District, Shenzhen. It is a one-stop manufacturer of PCBA&SMT surface mount processing for 14 years, mainly engaged in PCBA electronic manufacturing and processing services. It provides enterprise customers with PCBA labor and material packaging, SMT surface mount processing, PCBA surface mount rapid sampling, DIP plug-in, post soldering, functional testing, spraying and PCBA assembly to meet the one-stop production needs of PCBA&SMT surface mount processing, and supports customized production modes of 0EM/0DM.
The company's product processing areas include automotive electronics, industrial control electronics, intelligent robots (lawn mowers, service robots), small household appliances, and pet electronics. We have 5 Yamaha SMT production lines, 2 DIP plug-in production lines, and 2 assembly lines, equipped with MES system, Yamaha YSM10 and YSM20 high-speed surface mount machines, automatic loading machines, fully automatic printing machines, SPI solder paste automatic detectors, 12 temperature zone reflow soldering, nitrogen furnace, first piece inspection instrument, online AOI detector, X-RAY 1800 detection machine, 2 ovens, three proof paint equipment solder paste mixer, 2 wave soldering machines, 1 selective soldering machine, and related testing equipment.
The daily standard production capacity of SMT is about 10 million points, and the daily production capacity of DIP plugins is about 200000 points. SMT mounting can cover high-precision components such as 01005 and 0201, with a mounting accuracy of ± 0.03mm. It also supports BGA and other device mounting, with a BGA spacing mounting accuracy of ± 0.25mm and QFN of 0.35mm; SMT accuracy: laser recognition ± 0.05mm, image recognition: ± 0.03mm, component height: 6mm (maximum), pin spacing: laser recognition 0.65mm, high-resolution VCS 0.2mm, spherical spacing: laser recognition 1.0mm, high-resolution VCS 0.25mm, BGA spherical distance: ≥ 0.25mm, BGA ball center distance: ≥ 0.25mm, BGA ball diameter: ≥ 0.1mm, IC pin spacing: ≥ 0.2mm. The production process includes solder paste and red glue, and is processed using lead-free (RoHS) technology.
We can handle the processing of 1-16 layers of rigid PCB multilayer boards, with a maximum PCB surface size of 510mm × 410mm and a minimum processing board size of 50mm × 50mm. We can adapt to a variety of substrates, including FR-4, CEM-1, CEM-3, high TG boards, halogen-free FR4, FR-1, FR-2, and aluminum substrates; The plate thickness processing range is 0.2-7.0mm, and the copper foil thickness supports 0.5-4.0oz. At the same time, it can complete the production and processing of special plates such as high TG materials.
Weijin Technology has passed the ISO9001 quality management system and carries out relevant management work in accordance with IPC-A-610F and RoHS standards for product quality. It continues to improve production, process, and quality management processes. The company has established a comprehensive testing system, equipped with SPI solder paste detector, online AOI, X-Ray testing equipment, and functional testing fixtures, to carry out quality control throughout the production process. The first piece must be tested every time the line is changed, and 100% AOI testing and X-Ray testing are conducted before shipment. QA inspection is carried out before each batch of PCBA boards is shipped to ensure that there are no defective or substandard products.
